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Applications
Wire Bond Pad Cleaning
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ISSUE
The presence of contamination on the die pad causes the wire under the ultrasonic tool to slip and not generate the heat required to weld the wire to the die pad.
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Cleaning Pd-Ag Die Attach Pads
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Sputters away the oxygen of the silver oxide and removes surface organics
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Cleaning Gold Plated Parts
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Sputters away the oxygen of the gold oxide
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Epoxy Bleed Removal
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Epoxy bleed is caused during die attachment with epoxy adhesive. The epoxy components have different affinity for the ceramic substrate. Some of the components wet the substrate beyond the footprint of the die. This is referred to as epoxy bleed.
Sputters or oxidizes the epoxy bleed
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Photoresist Removal
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Photoresist removal and via descumming can be oxidized using an oxygen plasma.
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Cleaning Ceramic Substrates
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Sputters or oxidizes the organic contaminants
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Cleaning Glass Parts
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Sputters or oxidizes the organic contaminants
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Cleaning Optics
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Sputters or oxidizes the organic contaminants
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Cleaning Semiconductor Surfaces
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Sputters or oxidizes the organic contaminants
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Removal of Plastic Encapsulants
for Failure Mode Analysis
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Oxidizes the encapsulant, in conjunction with CF4 or SF6 removes SiO2 filler
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Surface Preparation of Plastics for Gluing
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Surface oxidation forming -OH and epoxy bonds.
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Cleaning Silver Plated Parts
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Sputters away the oxygen of the silver oxide and removes surface organics
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Reduction of Some Metal Oxides
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Sputters away the oxygen
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Removal of Oil or Epoxy Residues
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Sputters or oxidizes the oil or epoxy
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